Stacked 3d package with improved bandwidth and power efficiency
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), 2013
Stacked die packages such as PoP are used in space - constrained portable systems e,g. SmartPhone... more Stacked die packages such as PoP are used in space - constrained portable systems e,g. SmartPhones. The processor ( SoC ) and Mobile DRAM chips are stacked vertically to fit the combination within the restricted board space. The use of wire bonds in the memory chips as well as package level interconnects introduces delays into the data transmitted between the chips and limits the max. clock rate ( at present about 533 MHz for LP DDR 2 memory ) and hence the data transfer rate / bandwidth to less than 6.4 GB per sec. For Smart Phones to become capable of PC quality Games and high speed video would require a doubling of the bandwidth to over 12.8 GB per sec. To achieve that target PoP type packages were to be replaced by 3-d stacks using TSVs and wide I/Os. However recently JEDEC has postponed the introduction of Wide I/O Mobile memory stacks ( using TSVs ) to 2015. So the bandwidth of PoP packages must be improved. A physical way to increase the Bandwidth between the SoC and memory c...
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Papers by Dev Gupta