Flip chip soldering and adhesive bonding on organic substrates
Flip chip interconnections to organic substrates were realized using different techniques: solder... more Flip chip interconnections to organic substrates were realized using different techniques: soldering using mechanical solder ball bumps and adhesive bonding with isotropic conductive adhesive. Both approaches use an electrolessly deposited nickel-gold under bump metallization. The feasibility of these methods is demonstrated and their properties are compared
Packaging of an electronic-microfluidic hybrid sensor
Biotechnoloby and microelectronics have begun to merge to form 'an alliance in battling disea... more Biotechnoloby and microelectronics have begun to merge to form 'an alliance in battling diseases. analyzing hazardous ambients and much more. Cmcial for this was the development of microfluidic components and respective microelectronic based sensors As mass inaiiufacturing allows to bring the research results from the lab to the market. solutions to merge the two disciplines in a cost effective. performance orientcd "ay are needed. Packaging can play a cmcial role here. as a seamless intcgation of microfluidics and microelectronics paves the way to commercially attractive products. The paper describes the development of a packaging strategy for the seamless integration of a microfluidic SlNCtured carrier and a sensor chip in a prototype package that can easily be upscaled to production. The concept, the applied technologies and dimensioning will be described.
Bioelectronics Devices – Microtechnology enabling a revolution
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Mar 6, 2022
We present an integration approach of a CMOS biosensor into a polymer based microfluidic environm... more We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.
Aluminium Printed Circuit Board Technology For Biomedical Micro-Devices
This paper presents an innovative Printed Circuit Board (PCB) technology for biomedical microdevi... more This paper presents an innovative Printed Circuit Board (PCB) technology for biomedical microdevices. The fabrication process combines biocompatible tested materials and pure metal layers to build micro systems that mix active/passive electronics with microfluidics. Its peculiarity with respect to existing technologies is that it uses standard PCB processes, thereby preserving its characteristics as low production cost and large scale development, necessary for disposable applications
Method for producing optical sensor for mounting on carrier substrate, involves providing optical transparent plate with lateral dimensions larger than sensor chip
Overview of Component Level Devices
Microsystems
... For shock sensors, the design is set for a freely moving proof mass to ... Infineon has demon... more ... For shock sensors, the design is set for a freely moving proof mass to ... Infineon has demonstrated a hybrid integrated dual microphone, leveraging directional sound discrimination through ... derived from watch making, as well as semiconductor related MEMS fabrication processes ...
Flip chip soldering and adhesive bonding on organic substrates
Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium
Flip chip interconnections to organic substrates were realized using different techniques: solder... more Flip chip interconnections to organic substrates were realized using different techniques: soldering using mechanical solder ball bumps and adhesive bonding with isotropic conductive adhesive. Both approaches use an electrolessly deposited nickel-gold under bump metallization. The feasibility of these methods is demonstrated and their properties are compared
Packaging of Micro Devices for Automotive Applications - Techniques and Examples
VDI-Buch
Micro systems and micro devices play an important role in automotive applications. Today, sensors... more Micro systems and micro devices play an important role in automotive applications. Today, sensors and actuators allow to increase safety, comfort and economy of modern cars. In order to facilitate the use of such fragile devices, packaging of these structures is on major ...
Alternative solders for flip chip applications in the automotive environment
Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204)
... AUTOMOTIVE ENVIRONMENT Erik Jung, Katrin Heinricht, Joachim Kloeser, Rolf Aschenbrenner and H... more ... AUTOMOTIVE ENVIRONMENT Erik Jung, Katrin Heinricht, Joachim Kloeser, Rolf Aschenbrenner and Herbert Reichl" ... This paper presents a flip chip technique based on electroless NYAu bumping and stencil printing of solder paste on wafers. ...
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
1997 Proceedings 47th Electronic Components and Technology Conference, 1997
This paper presents a flip chip technology based on an electroless Ni/Au bumping process which ha... more This paper presents a flip chip technology based on an electroless Ni/Au bumping process which has been developed by IZM/TUB. Nickel bumps offer a surface with very good suitability for flip chip soldering. In the following an interconnection method is described which uses ultra fine pitch stencil printing of solder paste on wafers, ceramic and organic substrates. The eutectic Pb/Sn
Packaging of an electronic-microfluidic hybrid sensor
53rd Electronic Components and Technology Conference, 2003. Proceedings.
Biotechnoloby and microelectronics have begun to merge to form 'an alliance in battling disea... more Biotechnoloby and microelectronics have begun to merge to form 'an alliance in battling diseases. analyzing hazardous ambients and much more. Cmcial for this was the development of microfluidic components and respective microelectronic based sensors As mass inaiiufacturing allows to bring the research results from the lab to the market. solutions to merge the two disciplines in a cost effective. performance orientcd "ay are needed. Packaging can play a cmcial role here. as a seamless intcgation of microfluidics and microelectronics paves the way to commercially attractive products. The paper describes the development of a packaging strategy for the seamless integration of a microfluidic SlNCtured carrier and a sensor chip in a prototype package that can easily be upscaled to production. The concept, the applied technologies and dimensioning will be described.
A multi-test platform to evaluate the barrier properties of electronic encapsulants for advanced medical implants
2009 59th Electronic Components and Technology Conference, 2009
In this paper we present a multi-test platform to evaluate the barrier properties of encapsulatio... more In this paper we present a multi-test platform to evaluate the barrier properties of encapsulation materials to be used to encapsulate electronic and implantable medical devices. This test platform leverages multiple material and process evaluation on one single substrate. Both cytotoxicity and cytoproliferation tests are possible, in combination with evaluation of barrier properties and aging monitoring structures. Process evaluation structures on conformality and maximum aspect ratios are included. The realization of the platform from concept to the fabrication process are given and the experimental details in accordance to ISO 10993 are described.
A Hybrid Microfluidic-EWOD System for Complex PoC-Devices
Proceedings of the 9th International Conference on Multi-Material Micro Manufacture, 2012
ABSTRACT A hybrid microfluidic-EWOD (electro-wetting on dielectrics) system has been developed to... more ABSTRACT A hybrid microfluidic-EWOD (electro-wetting on dielectrics) system has been developed to meet the demand of fast detection and analysis tools in the field of ambulant diagnostics. The microfluidic device generates discrete droplets at the exit of a micropipette in which the EWOD system coordinates the motions of discrete droplets using a planar array of electrodes. In this work, a dispenser microfluidic system based on a two level microfluidic system was designed and fabricated in silicon using clean room technology then replicated in poly-dimethylsiloxane (PDMS) and cyclic olefin copolymer (COC). This system improves the mechanism of breakup of droplet due to modification of hydraulic diameter.
Combination of Channel-and Droplet-Based Microfluidics for Complex PoC-Devices
Proceedings of the 8th International Conference on Multi-Material Micro Manufacture, 2011
ABSTRACT This paper presents a microfluidic device addressing the field of ambulant diagnostics i... more ABSTRACT This paper presents a microfluidic device addressing the field of ambulant diagnostics in rural areas. Often, the diagnostic approach of micro-channel based point of care devices (PoCD) will target a certain marker - if e.g. on site another marker is to be checked against, the visiting doctor needs to use another test device. With the number of markers growing on a steady basis this will incur the need to transport a large number of individual test strips/cartridges, making the PoCD concept useless for this specific setting. The basis of the proposed novel device is a hybrid system combining the advantages of conventional channel-based fluidics with those of digitally controlled droplet-based fluidics. This hybrid concept uses a micro-channel based delivery partition for stored reagents with a disposable reaction partition based on electrowetting-on-dielectric to run the actual test protocol. It promises to realize a low cost approach for a Point-of-Care system with easy deployability. Conceptual implementation was done by roll embossing for the microchannels and direct structuring of the electrode elements for the EWOD substrate. The latter was laminated with a PTFE-film or coated with a nanoparticle loaded lacquer for hydrophobization. A variety of reagents were handled using a two-phase containment on the EWOD substrate, overcoming the issues associated with low surface energy fluids.
Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications
Microtechnologies are widely used in many applications as e.g. for the automotive or telecommunic... more Microtechnologies are widely used in many applications as e.g. for the automotive or telecommunication industry. But it could be also a versatile tool for biological and biomedical applications. Microwells have been established long in this application field but remained without any additional functionality up to now. Merging new fabrication techniques and handling concepts with microelectronics enables the realization of intelligent
Electronic Components and Technology Conference, 2009
Multiwell plates in combination with optical inspection equipment are standard tools for biologic... more Multiwell plates in combination with optical inspection equipment are standard tools for biological and biomedical applications e.g. cell-to-cell interaction studies for cancer treatment. Microtechnology based multiwell plates have the potential to monitor physiological cellular interactions at single cell level with a high throughput e.g. for immunotherapy of cancer or targeted drug delivery, where each patient would receive drugs that are
An integrated electronic meniscus sensor for measurement of evaporative flow
Sensors and Actuators A: Physical, 2008
This paper presents an electronic sensor of the meniscus height at the outlet of an open micro-we... more This paper presents an electronic sensor of the meniscus height at the outlet of an open micro-well. It is shown that it can be used to compute the average velocity of the flow induced by evaporation. The sensor is built using a technology for bio-medical micro-devices based on Printed Circuit Board (PCB) manufacturing to allow future integration of it in
Lab-on-substrate technology platform
physica status solidi (a), 2009
Abstract A technology platform based on standard PCB technology has been developed for cost-effec... more Abstract A technology platform based on standard PCB technology has been developed for cost-effective fabrication of biological and medical test devices. Aluminum, polyimide and Pyralux have been selected as materials with focus on bio-and process compatibility. A ...
Microtechnology becomes a versatile tool for biological and biomedical applications. Microwells h... more Microtechnology becomes a versatile tool for biological and biomedical applications. Microwells have been established long but remained non-intelligent up to now. Merging new fabrication techniques and handling concepts with microelectronics enables to realize intelligent microwells suitable for future improved cancer treatment. The described technology depicts the basis for the fabrication of electronically enhanced microwell. Thin aluminium sheets are structured by laser micro machining and laminated successively to obtain registration tolerances of the respective layers of <5µm. The microwells lasermachined into the laminate are with 50…350µm diameter, allowing to contain individual cells within the microwell as well as provide access holes for the layer-to-layer contacting A permeable membrane attached to the bottom of the microwell plate is used for fluid handling. The individual process steps are described and results on the microstructuring as well as on biocompatibility of the materials are given.
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Papers by Erik Jung