This article is an open access article distributed under the terms and conditions of the Creative... more This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY
Simulation Analysis of the Bit Error Induced by EMI on Galvanically Isolated Data-Link Embedded in an Automotive Battery Management IC
Ultra-Low Power and Minimal Design Effort Interfaces for the Internet of Things
This paper reviews the results of recent researches aimed to extend the standard-cell based digit... more This paper reviews the results of recent researches aimed to extend the standard-cell based digital design flow to analog building blocks, so that to enhance scalability, reconfigurability and portability across technology nodes and to reduce design effort, time-to-market and costs. In this framework, the application of the proposed fully digital design approach to a wake up oscillator and to a Digital-to-Analog Converter, which are two building blocks widely employed in IoT sensor nodes, is illustrated in detail.
He received the Laurea degree (summa cum laude) and the Ph.D. degree in electronic engineering fr... more He received the Laurea degree (summa cum laude) and the Ph.D. degree in electronic engineering from the Politecnico di Turin, Turin, in 2000 and 2003, respectively. He is currently an Associate Professor of Electrical Engineering with the Department of Electronics and Telecommunications (DET), Politecnico di Torino, Turin. He has co-authored more than 75 articles appearing in journals and international conference proceedings. His research interests are in the fields of analog, mixed-signal, and power integrated circuit (IC) design and IC-level and System level Electromagnetic Compatibility (EMC). Prof. Crovetti is a Senior Member of the IEEE and serves as the Subject Editor-in-Chief of IET Electronics Letters in the area of Circuits and Systems and as an Associate Editor of the IEEE Transactions on VLSI Systems. vii Preface to "Electromagnetic Interference and Compatibility" Due to the continuous progress in semiconductor technology and the rapidly evolving application scenarios, electromagnetic compatibility (EMC) is constantly raising new challenges and is a very dynamic field of research. In this context, this collection of papers, originally published in the "Electromagnetic Interference and Compatibility" Special Issue of Electronics for which I served as a Guest Editor, offers a vivid picture of the EMC research challenges and directions over the last years in this complex and multifaceted field. Focusing on EMC in communication systems, the paper "Interference of Spread-Spectrum EMI and Digital Data Links under Narrowband Resonant Coupling" by Crovetti and Musolino highlights how traditional methods like spread-spectrum clock modulation, developed with reference to AM and FM radio receivers, are no longer well suited to digital communications. In the very crucial field of EMC in power electronics, the paper "Signal Transformations for Analysis of Supraharmonic EMI Caused by Switched-Mode Power Supplies" by Sandrolini and Mariscotti explores advanced signal processing techniques (Wavelet Packet Transform and the Empirical Mode Decomposition) in the analysis of electromagnetic emissions of power converters, while in "Modeling and Optimization of Impedance Balancing Technique for Common Mode Noise Attenuation in DC-DC Boost Converters," by Shuaitao Zhang et al. more conventional balancing techniques are optimized to attenuate common-mode emissions. For new application scenarios, EMC challenges in emerging electric vehicles are addressed in "Electromagnetic Susceptibility of Battery Management Systems' ICs for Electric Vehicles: Experimental Study," by Aiello. Moreover, IC-level EMC issues in operational amplifiers are addressed in "EMI Susceptibility of the Output Pin in CMOS Amplifiers" by Richelli, Colalongo, and Kovacs-Vajna, and the susceptibility of Hall Effect sensors is studied in "Hall-Effect Current Sensors Susceptibility to EMI: Experimental Study" by Aiello. New contributions in the area of cross-talk reduction and signal/power integrity are presented in "A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over" by Jung-Han Lee and in "A Dual-Perforation Electromagnetic Bandgap Structure for Parallel-Plate Noise Suppression in Thin and Low-Cost Printed Circuit Boards" by Myunghoi Kim. The active research area on the EMC properties of materials and their application to the suppression of interference is represented in this volume by "Shielding Properties of Cement Composites Filled with Commercial Biochar" by Yasir et al. and by "Synthesis and Characterization of Polyaniline-Based Composites for Electromagnetic Compatibility of Electronic Devices" by Gareev et al. Last, but not least, new contributions on ferrite cores and their characterization are presented in "Performance Study of Split Ferrite Cores Designed for EMI Suppression on Cables" by Suarez et al. and in "Simple Setup for Measuring the Response to Differential Mode Noise of Common Mode Chokes" by González-Vizuete et al. Though not exhaustive, the papers collected in this volume can be useful to address practical EMC problems and stimulate future research and should be well received by the EMC community.
IEEE Transactions on Circuits and Systems Ii-express Briefs, Aug 1, 2011
A nonlinear mechanism which affects common-mode rejection (CMR) of fully differential integrated ... more A nonlinear mechanism which affects common-mode rejection (CMR) of fully differential integrated operational amplifiers (opamps) is highlighted and analysed by computer simulations. In particular, it is shown how the finite CMR of fully differential opamp circuits under practical operating conditions is mainly related to such a mechanism rather than to transistor mismatch.
This special session paper introduces the Horizon Europe NEUROPULS project, which targets the dev... more This special session paper introduces the Horizon Europe NEUROPULS project, which targets the development of secure and energy-efficient RISC-V interfaced neuromorphic accelerators using augmented silicon photonics technology. Our approach aims to develop an augmented silicon photonics platform, an FPGA-powered RISC-V-connected computing platform, and a complete simulation platform to demonstrate the neuromorphic accelerator capabilities. In particular, their main advantages and limitations will be addressed concerning the underpinning technology for each platform. Then, we will discuss three targeted use cases for edge-computing applications: Global National Satellite System (GNSS) anti-jamming, autonomous driving, and anomaly detection in edge devices. Finally, we will address the reliability and security aspects of the stand-alone accelerator implementation and the project use cases. Index Terms-artificial neural networks, modeling, simulation This project has received funding from the European Union's Horizon Europe research and innovation programme under grant agreement No. 101070238. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union. Neither the European Union nor the granting authority can be held responsible for them.
HAL (Le Centre pour la Communication Scientifique Directe), Nov 14, 2002
In this paper the susceptibility of integrated bandgap voltage references to Electromagnetic Inte... more In this paper the susceptibility of integrated bandgap voltage references to Electromagnetic Interference (EMI) is investigated by on-chip measurements carried out on Kuijk and Tsividis bandgap circuits. These measurements highlight the offset in the reference voltage induced by continuous wave (CW) EMI and the complete failures which may be experienced by bandgap circuits. The role of the susceptibility of the startup circuit and of the operational amplifier which are included in such circuits is also focused.
This article is an open access article distributed under the terms and conditions of the Creative... more This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY
2022 International Symposium on Electromagnetic Compatibility – EMC Europe
Power Line Communication (PLC) technologies utilize existing power cables for both power and data... more Power Line Communication (PLC) technologies utilize existing power cables for both power and data transmission which minimizes cost and complexity. However, recent studies show that alternative modulation schemes such as Random Pulse Width Modulation (RPWM), applied to power converter to minimize conducted emissions, have possible side effects on the PLC system. In this work, the effects of the switching frequency of randomly modulated power converter on the G3-PLC system is investigated. To this end, a range of switching frequencies from 10 kHz-100 kHz is applied to a randomly modulated DC-DC converter and its potential effect on the G3-PLC is studied. Experimental results confirmed that switching frequencies near the bandwidth of the G3-PLC caused significant disturbance and possible coexistence issue compared to the frequencies out of this range. Moreover, there is a tradeoff between Electromagnetic Interference (EMI) reduction and coexistence issue that is Random Frequency Modulation, which is very effective for EMI reduction, is found to be very disruptive for G3-PLC, compared to alternative random modulation techniques like Random Pulse Position Modulation.
Wiley Encyclopedia of Biomedical Engineering, 2006
He received the Laurea degree (summa cum laude) and the Ph.D. degree in electronic engineering fr... more He received the Laurea degree (summa cum laude) and the Ph.D. degree in electronic engineering from the Politecnico di Turin, Turin, in 2000 and 2003, respectively. He is currently an Associate Professor of Electrical Engineering with the Department of Electronics and Telecommunications (DET), Politecnico di Torino, Turin. He has co-authored more than 75 articles appearing in journals and international conference proceedings. His research interests are in the fields of analog, mixed-signal, and power integrated circuit (IC) design and IC-level and System level Electromagnetic Compatibility (EMC). Prof. Crovetti is a Senior Member of the IEEE and serves as the Subject Editor-in-Chief of IET Electronics Letters in the area of Circuits and Systems and as an Associate Editor of the IEEE Transactions on VLSI Systems. vii Preface to "Electromagnetic Interference and Compatibility" Due to the continuous progress in semiconductor technology and the rapidly evolving application scenarios, electromagnetic compatibility (EMC) is constantly raising new challenges and is a very dynamic field of research. In this context, this collection of papers, originally published in the "Electromagnetic Interference and Compatibility" Special Issue of Electronics for which I served as a Guest Editor, offers a vivid picture of the EMC research challenges and directions over the last years in this complex and multifaceted field. Focusing on EMC in communication systems, the paper "Interference of Spread-Spectrum EMI and Digital Data Links under Narrowband Resonant Coupling" by Crovetti and Musolino highlights how traditional methods like spread-spectrum clock modulation, developed with reference to AM and FM radio receivers, are no longer well suited to digital communications. In the very crucial field of EMC in power electronics, the paper "Signal Transformations for Analysis of Supraharmonic EMI Caused by Switched-Mode Power Supplies" by Sandrolini and Mariscotti explores advanced signal processing techniques (Wavelet Packet Transform and the Empirical Mode Decomposition) in the analysis of electromagnetic emissions of power converters, while in "Modeling and Optimization of Impedance Balancing Technique for Common Mode Noise Attenuation in DC-DC Boost Converters," by Shuaitao Zhang et al. more conventional balancing techniques are optimized to attenuate common-mode emissions. For new application scenarios, EMC challenges in emerging electric vehicles are addressed in "Electromagnetic Susceptibility of Battery Management Systems' ICs for Electric Vehicles: Experimental Study," by Aiello. Moreover, IC-level EMC issues in operational amplifiers are addressed in "EMI Susceptibility of the Output Pin in CMOS Amplifiers" by Richelli, Colalongo, and Kovacs-Vajna, and the susceptibility of Hall Effect sensors is studied in "Hall-Effect Current Sensors Susceptibility to EMI: Experimental Study" by Aiello. New contributions in the area of cross-talk reduction and signal/power integrity are presented in "A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over" by Jung-Han Lee and in "A Dual-Perforation Electromagnetic Bandgap Structure for Parallel-Plate Noise Suppression in Thin and Low-Cost Printed Circuit Boards" by Myunghoi Kim. The active research area on the EMC properties of materials and their application to the suppression of interference is represented in this volume by "Shielding Properties of Cement Composites Filled with Commercial Biochar" by Yasir et al. and by "Synthesis and Characterization of Polyaniline-Based Composites for Electromagnetic Compatibility of Electronic Devices" by Gareev et al. Last, but not least, new contributions on ferrite cores and their characterization are presented in "Performance Study of Split Ferrite Cores Designed for EMI Suppression on Cables" by Suarez et al. and in "Simple Setup for Measuring the Response to Differential Mode Noise of Common Mode Chokes" by González-Vizuete et al. Though not exhaustive, the papers collected in this volume can be useful to address practical EMC problems and stimulate future research and should be well received by the EMC community.
A 28 nm 368 fJ/cycle, 0.43%/V Supply Sensitivity, FLL based RC Oscillator Featuring Positive TC Only Resistors and ΣM Based Trimming
IEEE Transactions on Circuits and Systems Ii-express Briefs, 2023
Design of a 1st-Order Continuous-Time $$\Sigma \Delta$$ Modulator with a Digital-Based Floating-Inverter Integrator
Lecture notes in electrical engineering, Nov 28, 2023
A New Compact Temperature-Compensated
This paper describes a new circuit integrated on silicon, which generates temperature-independent... more This paper describes a new circuit integrated on silicon, which generates temperature-independent bias currents. Such a circuit is firstly employed to obtain a current reference with first-order temperature compensation, then it is modified to obtain second-order temperature compensation. The operation principle of the new circuits is described and the relationships between design and technology process parameters are derived. These circuits have been designed by a 0.35 m BiCMOS tech- nology process and the thermal drift of the reference current has been evaluated by computer simulations. They show good thermal performance and in particular, the new second-order tempera- ture-compensated current reference has a mean temperature drift of only 28 ppm C in the temperature range between C and 100 C.
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Papers by Paolo Crovetti