SEMI Taiwan

⚡ The next race in AI chips will be won where advanced process technology meets AI enablement. “This year’s IC Forum will focus on global industry trends and explore key advanced semiconductor process technologies, AI-enabled process development, and the future direction of next-generation AI chips.” Steven Hsu (Shih Chieh Hsu), Vice President of Technology Development at United Microelectronics Corporation (UMC), offers a clear view of how advanced processes and AI are accelerating each other. AI does not simply require more advanced chips - it is also changing how those chips are developed. The IC Forum-Advanced Chip Technology and Manufacturing focuses on the transition from FinFET to GAA, exploring key enabling technologies such as EUV and ALD, while looking ahead to emerging innovations including CFET and backside power delivery networks (BSPDN). AI is also being increasingly integrated into EDA and yield management. From #AngstromEra and #GAA to #CFET and #BacksidePowerDelivery, the industry is pursuing more than smaller process nodes - it is building the comprehensive manufacturing capabilities needed to push silicon technology forward. The SEMICON Taiwan 2026 IC Forum will connect materials, equipment, process integration, and AI chip trends to map the road ahead for #AdvancedProcesses. Seats are limited—secure your place today. 🔗 Full agenda and registration information: https://bit.ly/4pEST0i 📍 SEMICON Taiwan 2026 September 2–4 | TaiNEX 1 & 2 💡Save 20% with early-bird registration through August 5. Forum registration also includes complimentary exhibition admission. 👉 Register Now: https://lnkd.in/gXWm7crF #SEMICONTaiwan #SEMI #AdvancedProcesses #AngstromEra #GAA #CFET #BacksidePowerDelivery #AIChips

SEMICON Taiwan 2026｜Transform Tomorrow SEMI hosted the SEMICON Taiwan 2026 Global Pavilion Press Conference, Terry Tsao, Global Chief Marketing Officer and President of Taiwan at SEMI welcomed Cynthia Kiang, Deputy Minister, Ministry of Economic Affairs; and distinguished representatives from the American Institute in Taiwan, the Japan–Taiwan Exchange Association, the European Economic and Trade Office, and the British Office Taipei. Together, they explored ways to deepen collaboration in semiconductors, AI, and talent development, highlighting Taiwan’s strength as a key global semiconductor hub and its close ties with international partners. Terry Tsao, Global Chief Marketing Officer and President of Taiwan at SEMI, stated: “The rapid expansion of global AI infrastructure is redefining the strategic landscape of the semiconductor industry. At this pivotal moment, semiconductors are no longer simply a matter of technology, but a strategic priority that countries and regions must address together. The participation of 18 countries  and the first joint appearance of representatives from four economies are tangible reflections of this shift. SEMICON Taiwan aims to deepen this global dialogue and work alongside partners worldwide to define the industry’s next chapter. Representatives from 17 countries attended the event in person. Representatives from the United States, Japan, the European Union, and the United Kingdom each shared the latest developments in their collaboration with Taiwan's semiconductor ecosystem, highlights of their respective country pavilions at SEMICON Taiwan 2026, and opportunities for further bilateral industry cooperation. Their insights offered firsthand perspectives on industry developments and policy directions. #SEMICONTaiwan2026 #TransformTomorrow #Semiconductors

In the Age of Rapid AI Advancement, Technology Is Just the Entry Ticket “With the rapid advancement of AI, high-performance computing, advanced packaging, and leading-edge process technologies, the semiconductor industry is entering a pivotal period of growth,” says Alvin Hsieh, Country President of Entegris Taiwan (Entegris) At the heart of the global semiconductor supply chain, Taiwan is well positioned to capture a new wave of growth opportunities and #StrategicMaterials will provide an essential foundation for continued advances in semiconductor manufacturing and packaging. Alvin Hsieh will also attend at the SEMICON Taiwan 2026 Strategic Materials Conference, joining industry experts from around the world to discuss materials innovation, supply chain development, and emerging technology trends in the AI era. Supply chain resilience, technological innovation, and talent development are closely connected and each plays an important role in advancing the semiconductor industry. 🔗 Full agenda and registration information: https://lnkd.in/grrqZv9E Beyond the conference, SEMICON Taiwan 2026 will also feature the #MaterialsPavilion, bringing together companies across the semiconductor materials supply chain - including photolithography materials, wafers, chemical solutions, chemical vapour deposition materials, ceramic packaging, and package substrates - to foster industry exchange and collaboration. 📍 SEMICON Taiwan 2026 September 2–4 | TaiNEX 1 & 2 💡 Enjoy 20% off with early-bird registration and receive complimentary exhibition admission when you register for the conference. 👉 Register now: https://lnkd.in/gXWm7crF #SEMICONTaiwan #SEMI

Inspection & Metrology Are No Longer Just Supporting Tech - They’re Key Enablers of Yield and Resilience I-Shih Tseng, CEO of Chroma ATE Inc. and Program Chair of the SEMICON Taiwan 2026 Semiconductor Advanced Inspection and Metrology Forum, states: "Inspection and metrology are no longer just supporting technologies - they now play a critical role in strengthening process resilience, improving yield stability, and enabling rapid response to manufacturing challenges.” Advanced packaging and heterogeneous integration are redefining the complexity of semiconductor manufacturing. As process requirements grow ever more demanding, even nanometer-level deviations can have a decisive impact on overall performance. Inspection and metrology have become essential to ensuring high yields and robust processes, driving strong momentum for resilience and innovation across the semiconductor ecosystem. The Semiconductor Advanced Inspection and Metrology Forum will offer comprehensive insight into the key solutions shaping semiconductor development, market trends, and industry applications. 👉 Register now to get ahead of the industry's next shift! 🔗 Full Agenda & Registration: https://surl.li/ldfeha The exhibition’s #TestingPavilion will showcase ATE and precision measurement technologies, high-speed digital, RF, PMIC, and wide-bandgap semiconductor (SiC/GaN) testing solutions, alongside non-contact optical sensing technologies to help ensure the yield and reliability of advanced chips. 📍 SEMICON Taiwan 2026 September 2–4 | TaiNEX 1 & 2 💡 20% Early Bird Discount - register for the forum and enjoy free exhibition access 👉 Register Now: https://lnkd.in/gXWm7crF #SEMICONTaiwan #SEMI

🚀 In the AI Era, Reliability Isn't Just About Testing Chips - It's About Testing the Entire System "From Silicon to System, testing is facing new challenges," says Lisa Chen, Director of NPI Test and Product Engineering at NXP Semiconductors, also the moderator of the SEMICON Taiwan 2026 Advanced Testing Forum, highlighting the growing importance of advanced testing in the age of rapid AI evolution. From #AdvancedProcess and #AdvancedPackaging to #SystemLevelValidation, testing challenges are expanding alongside the evolution of AI technology. As chiplets, HBM, and high-power AI systems accelerate into deployment, reliability is no longer just a component-level metric, it now extends to the stability of the entire system. How the industry demonstrates cross-disciplinary integration to build a stable foundation for the next wave of AI technology has become the new testing challenge of this generation. Themed "From Silicon to System: Redefining Reliability in the AI Age," the SEMICON Taiwan 2026 Advanced Testing Forum brings together semiconductor leaders to explore how testing is evolving from a quality-control function into a key driver of innovation across the entire value chain! 🔗 Full Agenda & Registration: https://shorturl.at/pa178 Beyond the forum, the #TestingPavilion will showcase advanced testing, metrology, validation, and AI/HPC test solutions, connecting the reliability ecosystem from chip to system. Don't miss the chance to get a first-hand look at the latest technologies shaping the reliability system! 📍 SEMICON Taiwan 2026 September 2–4 | TaiNEX 1 & 2 💡 20% Early Bird Discount through August 5 — register for the forum and enjoy free exhibition access 👉 Register Now: https://lnkd.in/gXWm7crF #SEMICONTaiwan #SEMI #TestAndMetrology #AdvancedTesting #SemiconductorIndustry

【Taiwan's Offshore Wind Experience on the Global Stage 】 As AI adoption accelerates and electricity demand continues to rise, offshore wind is becoming increasingly critical to building a resilient, low-carbon energy system. International collaboration will be essential to scaling deployment and strengthening supply chain resilience. Earlier this month, Lucas Lin, Chair of the GESA Wind Energy Industry Committee and Chairman of Synera Renewable Energy, represented GESA at the 4th World Forum Offshore Wind in Tokyo, Japan. Under the theme "From Ambition to Project Execution," the forum convened industry leaders, policymakers, and experts from across Asia and Europe to exchange perspectives on offshore wind development, project execution, floating wind, regional collaboration, and energy security. During the forum, Chair Lin shared Taiwan's experience in offshore wind development, highlighting how AI-driven growth is reshaping renewable energy demand and reinforcing the need for cross-border collaboration. His insights sparked strong engagement throughout the event and were referenced in subsequent discussions—reflecting Taiwan's growing role in the global offshore wind dialogue. We believe accelerating the energy transition requires strong partnerships across industries and borders. By connecting government, industry, and international stakeholders, GESA continues to foster collaboration across offshore wind, solar, energy storage, hydrogen, and other net-zero technologies. Together, we can build a more resilient, competitive, and sustainable energy future. #GESAWindEnergyIndustryCommittee #SEMI #NetZeroTaiwan #EnergyTaiwan #WFO #APACSummit #WorldForumOffshoreWind Photo credited to: WFO APAC Summit 

🚀 The Next AI Revolution Hinges on "Materials" "AI is reshaping the semiconductor materials market landscape and redefining the global supply chain." Lewis Huang, Vice President of Taiwan Senju Electronic Materials and Moderator of the SEMICON Taiwan 2026 Strategic Materials Conference (SMC), concluded with this vision for the future of the industry. As AI computing demand continues to surge, the semiconductor industry is entering a new race. As Moore's Law approaches its limits, the industry is no longer just pursuing "smaller" - the focus has shifted to how system integration, advanced packaging, interconnect, thermal management and materials innovation can deliver more efficient, more powerful AI computing. From AI Infrastructure and the AI Factory, to the Token Economy, and now to Agentic AI and Physical AI. The semiconductor industry is preparing for an even larger AI era, and #AdvancedPackaging and #StrategicMaterials are the core battlegrounds for breaking through performance bottlenecks! SEMICON Taiwan 2026 brings you the most critical technology conversation of the AI era. Secure your spot now! 🔗 Full agenda and registration:https://bit.ly/4vqz1Q2 Beyond the forum, the exhibition also features #MaterialsPavilion and #CompoundSemiconductorArea, giving you a front-row view of the latest developments in strategic materials and industry exchange. 📍 SEMICON Taiwan 2026 September 2–4 | Nangang Exhibition Center, Halls 1 & 2 💡 Early bird 20% off — register for the forum and get free exhibition access 👉 Register now: https://lnkd.in/gXWm7crF #SEMICONTaiwan #SEMI

SEMICON Taiwan 2026 HIGS Day 3 Program Chair Dr. Albert Lan remarked: “AI is reshaping the semiconductor industry, with computing power serving as the fundamental driver of this transformation.” Dr. Lan highlighted three key dimensions - Big Data, Algorithms, and Computing Power - that define the AI era. As AI workloads continue to accelerate the technologies such as AI ASICs, HBM, Silicon Photonics, Interposer, and Advanced Substrates in CoWoS / CoPoS packages are emerging as the industry’s most important growth drivers. Advanced packaging, in particular, has become a critical enabler for next-generation AI computing. These transformative technologies and market trends will be the focus of the SEMICON Taiwan 2026 Heterogeneous Integration Global Summit, where global experts will share insights into technological innovations and future semiconductor supply chain opportunities. 🔗 Full agenda and registration: https://shorturl.at/WIKdo Explore the Packaging Technology Area and discover the 3DIC Advanced Packaging Pavilion, FOPLP Pavilion, Semiconductor Packaging Pavilion, and Chiplet Pavilion. Beyond the show floor highlights, SEMICON Taiwan 2026 will also host multiple summit forums from the three-day Heterogeneous Integration Global Summit to the FOPLP and 3DIC Global Summit precisely connecting you to global technology developments. 💡 Early bird 20% off register for the forum and get free show floor access 👉 Register now: https://lnkd.in/gVmn-934 👉 Watch the full video: https://lnkd.in/gCWhMNKi

From Carbon Reduction to Nature Positive - A Major New Milestone in Semiconductor ESG! More than half of the world's economic output depends on nature from forests and oceans to soils and biodiversity. These vital natural assets form the foundation of resilient and sustainable supply chains. SEMI has signed a Memorandum of Understanding (MOU) with TaiwanNational Park Service, Ministry of the Interior to jointly advance the Nature Positive Taiwan initiative, promoting nature conservation, biodiversity, and climate resilience. The collaboration will focus on five key areas: ▸ Establishing a corporate nature conservation matchmaking platform ▸ Promoting national park conservation values ▸ Deepening international exchange on sustainability and green transition ▸ Driving corporate environmental education and ecological engagement ▸ Sharing ESG and natural capital research and policy insights Together, these efforts aim to accelerate the development of Nature Positive Taiwan. SEMI Global Chief Marketing Officer and Taiwan President,Terry Tsao, said: "The boundaries of sustainability are expanding. From carbon management to natural capital, ESG is no longer just about climate." To date, the SEMI #Forest initiative has planted more than 150,000 trees worldwide, reducing over 304 metric tons of CO₂e emissions and helping restore 25 habitats. Looking ahead, SEMI will continue leveraging the #GESA (Green Energy and Sustainability Alliance) to engage more than 4,000 member companies, advancing biodiversity as a core pillar of corporate ESG and sustainable development. Director-General of National Park Service, Wang Cheng-Ji also expressed his expectations for the partnership, emphasizing that it will bring the strength of industry into Taiwan's environment, helping businesses move from sustainability commitments to meaningful action. The signing of MOU was also witnessed by representatives of SEMI member companies, including Sunny Li, Vice President of the Administrative Resource Center at ASE, and Joseph Wu, Senior Vice President, Strategic Planning and Administration Management at Nanya Technology. Their presence demonstrated the industry's strong commitment to Nature Positive initiatives and biodiversity, while also symbolizing the shared determination of businesses and the government to advance sustainable development together. Through collaboration, the partnership aims to amplify the impact of nature conservation while building a more resilient and biodiverse environment. As sustainability evolves from climate action to nature action; from Net Zero to Nature Positive The next step is not only to reduce environmental impact, but to help nature thrive alongside business. #SEMI #NaturePositive #NaturePositiveTaiwan #ESG #Sustainability #Biodiversity #ClimateAction #NetZero #Semiconductor #GESA

🤝 MIRDC × SEMI TAIWAN - Driving the Next Competitive Edge for Taiwan's Semiconductor Equipment Industry Taiwan is at the heart of the global semiconductor ecosystem. The next phase of its global competitiveness depends on advancing its semiconductor equipment industry through continuous innovation and deeper integration into global supply chains. In support of the government's "Greater South Silicon Valley" initiative and Southern Taiwan's Semiconductor S-Corridor development strategy, the Metal Industries Research & Development Centre (MIRDC) held the "Semiconductor Testing Laboratory Inauguration and MOU Signing Ceremony", officially launching its Semiconductor Testing Laboratory and signing Memoranda of Understanding (MOU) with SEMI. #MIRDC 👉 Provides R&D, testing and validation, engineering implementation, and local supply chain integration for semiconductor equipment technologies. #SEMITAIWAN👉 Connects the global semiconductor ecosystem through international standards, market intelligence, industry collaboration, and a network of more than 4,000 member companies. MOU was signed by Chia-Ju Liu, Chairman of MIRDC; Terry Tsao, SEMI Global Chief Marketing Officer and Taiwan President. Looking forward to bring together global industry platform and local technological expertise power to create a comprehensive development ecosystem. From R&D and testing to validation, commercialization, and international market access. Together, the partnership will help Taiwanese equipment and component suppliers integrate more deeply into the global semiconductor supply chain. The partnership aims to further strengthen Taiwan's presence and competitiveness in the global market Together, this collaboration will drive industry advancement across five key areas: ▸ Advancing semiconductor equipment and critical component technologies ▸ Building an end-to-end innovation pathway from R&D and testing to commercialization ▸ Expanding international collaboration and market access to help Taiwan's equipment industry integrate more deeply into global supply chains ▸ Accelerating the adoption of automation, digital transformation, and AI technology into equipment development ▸ Supporting the continued development of Southern Taiwan's Semiconductor S-Corridor while driving the transformation of traditional manufacturing industries As a global industry association, SEMI TAIWAN serves as a bridge between local innovation and global collaboration, helping Taiwan's semiconductor equipment industry strengthen its international competitiveness while creating new opportunities across the global semiconductor ecosystem. #SEMI #Semiconductor #SemiconductorEquipment #MIRDC #SupplyChain #Taiwan #SemiconductorDeviceMarker