Texas Semiconductor Innovation Fund Grants FormFactor Inc.

Continuing our series spotlighting the 10 finalists selected to pitch at the 2026 Lam Capital Venture Competition. Through this series, we’re highlighting the innovators, ideas, and technologies shaping the future of semiconductor manufacturing. Fourth: Amazing Cool Technology (https://bit.ly/4b0KiiG) Based in Taiwan and led by Quick Tsai, Amazing Cool Technology is developing an advanced materials platform for electronics, power, and thermal systems. Their work explores how advanced materials can improve conductivity, heat dissipation, and reliability across demanding semiconductor and power applications. The application in semiconductor manufacturing and packaging demonstrates its potential as a high-performance material, with future advancements expected to further support the efficient operation and stability of next-generation electronic devices. Congratulations to the Amazing Cool Technology team on being selected as a finalist in this year's competition. We look forward to following their continued progress as they work to bring next-generation advanced materials to high-performance electronics.

Semiconductor fabs require uninterrupted, precisely controlled local power. Even short disturbances can force tool shutdowns, reduce wafer yields, and create costly downtime. Many backup power systems depend on battery materials and chemical precursors concentrated overseas. SandboxAQ is building on AQVolt workflows that have screened more than 150,000 candidate compositions, identified promising cobalt-free cathode materials, and discovered a novel cryolite-type solid-state electrolyte now the subject of a pending patent application. Our goal is to accelerate development of battery systems that can support critical manufacturing infrastructure using domestically accessible materials. Learn more on our website: https://lnkd.in/e9NWDNpe

𝗕𝗲𝘆𝗼𝗻𝗱 𝘁𝗵𝗲 𝗕𝗼𝗮𝗿𝗱 𝗗𝗶𝘃𝗲𝗿𝘀𝗶𝗳𝗶𝗰𝗮𝘁𝗶𝗼𝗻 𝗮𝘀 𝗦𝘁𝗿𝗮𝘁𝗲𝗴𝘆 At Flexible Circuit Technologies (FCT), we've expanded beyond world-class flexible circuit manufacturing into assembly, vertical integration, and a growing global footprint. In this discussion, Ray Cottrell, Executive Vice President of Business Development, shares why diversification matters, how FCT is evolving from a supplier to a strategic manufacturing partner, and the key questions manufacturers should be asking as they prepare for the next wave of industry change. https://lnkd.in/g8eGts_q? I-Connect007 #FlexibleCircuits #ElectronicsManufacturing #EMS #SupplyChain

The deal expands Brewer's advanced materials portfolio as the Dayton region emerges as a semiconductor manufacturing hub. Here's what we know.

①This semiconductor company's €5 billion wafer fab starts early production, as Europe's largest power semiconductor manufacturing site...https://lnkd.in/g4FAU6fk ②Samsung Electro-Mechanics holds a 66% stake! This glass substrate core materials joint venture is officially established...https://lnkd.in/g4zz_B44

New Post: Amkor’s Arizona mega-plant could plug the holes in America’s chip ambitions — advanced packaging plant would reduce need to send US-produced chips to foreign shores for packaging and test amkor s arizona mega-plant could plug the — Amkor Technology has announced plans to construct a $2 billion advanced packaging and test facility in Peoria, Arizona, marking a significant step in bolstering the United States' semiconductor manufacturing capabilities.. Amkor Technology has announced plans to construct a $2 billion advanced packaging and test facility in Peoria, Arizona, marking a significant step in bolstering the United States’ semiconductor manufacturing capabilities. amkor s arizona mega-plant could plug the Overview of the New Facility amkor s arizona mega-plant could plug the: key context and updates inside. Amkor’s new facility will occupy a 104-acre site and... Visit https://www.hashe.com for all your IT needs

New Post: Amkor’s Arizona mega-plant could plug the holes in America’s chip ambitions — advanced packaging plant would reduce need to send US-produced chips to foreign shores for packaging and test amkor s arizona mega-plant could plug the — Amkor Technology has announced plans to construct a $2 billion advanced packaging and test facility in Peoria, Arizona, marking a significant step in bolstering the United States' semiconductor manufacturing capabilities.. Amkor Technology has announced plans to construct a $2 billion advanced packaging and test facility in Peoria, Arizona, marking a significant step in bolstering the United States’ semiconductor manufacturing capabilities. amkor s arizona mega-plant could plug the Overview of the New Facility amkor s arizona mega-plant could plug the: key context and updates inside. Amkor’s new facility will occupy a 104-acre site and... Visit https://www.hashe.com for all your IT needs

Flex Friday is here, and it's a big one! Today, we're excited to announce the release of our Ultraflex™ Cu-on-Polymer high-density interconnect (HDI) flexible substrate manufacturing process. This marks an important achievement for American Semiconductor, establishing the first U.S. manufacturing capability for 1µm flexible advanced substrates. The released process is now available to support customer process development programs and prototype fabrication for advanced semiconductor applications. We’re proud of the work our team has done to make this capability a reality and we look forward to helping customers bring new ideas to life with Ultraflex™. Read the full announcement below to learn more about our Ultraflex™ process and its advanced substrate capabilities.

The Section 48D Advanced Manufacturing Investment Credit — enacted under the CHIPS and Science Act of 2022 — offers a substantial federal incentive for companies investing in U.S. semiconductor manufacturing and related equipment production. The benefit was expanded under the One Big Beautiful Bill Act, increasing the potential credit rate from 25% to up to 35% for qualified projects placed in service after December 31, 2025. Read more below:

China Signs First Domestic Diamond Semiconductor Full-Chain Project, TrendForce Corp. reports. With a total investment of approximately USD 210 million, the facility will be equipped with 500 MPCVD systems for mass production of 2-inch to 4-inch single-crystal diamond wafers, alongside 50 production lines for spherical diamond powder. https://lnkd.in/eJH6SeQb