AIM Photonics’ Post

AIM Photonics' 4 day interactive experiential learning PIC Testing and Packaging Workshop kicks off tomorrow in Rochester! Participants will receive training in Passive PIC Testing – coupling/alignment, waveguide loss, and interference Active PIC Testing – modulation (Mach-Zehnder and ring resonator) and photodetection Packaging – dicing, die bonding, wire bonding, fiber attach (using both traditional and photonic wire bonding technology) and metrology at The Institute Of Optics at University of Rochester, the Rochester Institute of Technology, and AIM Photonics' Test, Assembly & Packaging (TAP) Facility. https://lnkd.in/gPUBRc_Y Learn more about the workshop here: https://lnkd.in/g3rGXBCH and our Education Workforce Development here: https://lnkd.in/gKChAhYk #picworkshop #educationworkforcedevelopment #PIC #test #assembly #packaging