FormFactor Inc.

We're hiring in Livermore, CA! FormFactor is seeking a Sr. Principal Plating Engineer to help drive innovations in advanced materials, electroplating technologies, and MEMS probe development. In this role, you'll lead strategic R&D initiatives, influence future technology roadmaps, and help enable next-generation semiconductor test solutions. Ready to make an impact? Explore the opportunity and apply today. #Hiring #Semiconductors #MaterialsScience #EngineeringJobs #MEMS

📅 Tomorrow Join FormFactor experts Alejandro Buritica and Ethan Caughey for: Is Your Probe Closing the Eye? Evaluating Wafer-Probe Performance for 224G and 448G During this webinar, we'll discuss: • Signal integrity challenges at 224G • Probe architecture evaluation criteria • Measurement confidence and repeatability • Considerations for future 448G applications Register now: https://lnkd.in/g96PPPis #SemiconductorTest #WaferTest #SignalIntegrity #224G #Webinar

As data rates move to 224G and beyond, evaluating probe technology requires looking beyond headline specifications. Engineers must balance multiple considerations: ✔ Signal integrity ✔ Current delivery through dense probe arrays ✔ Measurement consistency ✔ Measurement uncertainty As margins continue to shrink, even small sources of loss can influence results. What should engineers look for when evaluating high-speed probe technologies? Join us on July 23 as FormFactor experts discuss what engineers should consider when evaluating wafer-probe technologies for 224G and 448G applications. Register now: https://lnkd.in/g96PPPis #WaferTest #SignalIntegrity #SemiconductorTest #224G #Semiconductors

What can quantum technologies learn from semiconductor manufacturing? For decades, the semiconductor industry has advanced by using structured fabrication processes, process control monitoring, high-volume testing, and design-fabrication-test feedback loops. These methods helped improve yield, reduce variability, and support increasingly complex technologies. Quantum technologies are now facing their own scale-up challenge. Many device behaviors only emerge at cryogenic temperatures. Measurement throughput can be limited. Datasets are often smaller than what is needed to build predictive models. And fabrication variability can directly influence device performance. In our upcoming webinar, Beverly Boiko will explore how semiconductor manufacturing methodologies can help accelerate quantum technology development, including the role of wafer-level cryogenic characterization, statistical analysis, and emerging cryogenic PDK concepts. Register for the July 28 webinar: https://lnkd.in/gBPTcetT #QuantumComputing #Cryogenics #SemiconductorManufacturing #QuantumTechnology #WaferLevelTest

When people talk about AI infrastructure, the conversation usually focuses on GPUs, networking, and data centers. But the journey starts much earlier. Before AI accelerators reach deployment, they must be validated through increasingly sophisticated wafer-level test processes. As device complexity grows, probe technologies play an important role in helping engineers evaluate performance, identify issues earlier, and accelerate development. The future of AI infrastructure depends on confidence at every stage of the semiconductor lifecycle. Learn more about how AI, HBM, advanced packaging, and emerging architectures are reshaping semiconductor test. https://lnkd.in/gCAWymsF #AIInfrastructure #Semiconductors #AdvancedPackaging #WaferTest #Innovation

When the eye closes, is it the die or is it the probe? As data rates move to 224G and toward 448G, wafer probing is no longer just a contact problem. The probe becomes part of the signal path, making signal integrity, channel margin, and measurement confidence increasingly important. Join FormFactor experts Alejandro Buritica and Ethan Caughey as they discuss how engineering teams can evaluate wafer-probe performance for today's highest-speed applications and prepare for what's next. What you'll learn: ✔ Why 224G and 448G wafer probing requires treating the probe as part of the signal path ✔ How probe architecture can affect signal integrity, channel margin, and measurement confidence ✔ What engineers should look for when evaluating high-speed probe technologies ✔ A practical framework for assessing manufacturability and production readiness 📅 July 23, 2026 🌐 Online Webinar We hope you'll join the discussion. #SemiconductorTest #SignalIntegrity #WaferTest #224G #Semiconductors

As data rates move to 224G and beyond, engineering teams face a growing set of challenges during wafer test. Signal integrity, current delivery, measurement consistency, contact stability, and scalability all become increasingly important as margins continue to shrink. How should engineers evaluate probe technologies for today's highest-speed applications — and prepare for what's next? Join FormFactor experts Alejandro Buritica and Ethan Caughey on July 23 as they discuss practical considerations for evaluating wafer-probe performance at 224G and 448G. Registration links: US/EU Event - https://lnkd.in/gqA5vfnu Asia Event - https://lnkd.in/gF23JTkb #SemiconductorTest #SignalIntegrity #WaferTest #224G #Semiconductors

The AI infrastructure buildout happening globally is putting pressure on every layer of the semiconductor stack. At the wafer test level, that pressure shows up as a very specific problem. Data rates of 224Gbps per pin (soon going to 448Gbps) leave almost no room for the probe or testers to consume any margin at all. One question keeps coming up when I talk with test teams working at these speeds: When the eye closes, is it the die or is it the probe? At 224Gbps, the probe is the most critical part of the signal path. Geometry, force behavior, electrical path length -- all of it affects what you measure. A few dB in the wrong place and a good device looks like a failing one. On July 23, Alejandro Buritica and Ethan Caughey will walk through how to evaluate wafer-probe performance at 224Gbps and 448Gbps, what architecture-level solutions actually looks like, and what questions your team should be asking before accepting high-speed probe claims. If your team is navigating test at these speeds, I would genuinely enjoy the conversation. Registration link in the comments.

Scaling silicon photonics from the lab to high-volume manufacturing requires more than precision. It demands automation, repeatability, and throughput. Learn how TRITON™, the industry's first fully integrated silicon photonics test cell, combines optical and electrical wafer test, nano-precision alignment, and factory automation to help manufacturers scale production with confidence. Read the blog: https://lnkd.in/dpYM9hZn #SiliconPhotonics #SemiconductorTest #WaferTest #Photonics #SemiconductorManufacturing

Texas is where the technologies of tomorrow are manufactured today! A Texas Semiconductor Innovation Fund grant was extended to FormFactor Inc. for their new probe card manufacturing facility in Farmers Branch. The advanced manufacturing facility, which will produce core components used to test integrated circuits during wafer-level manufacturing, is expected to create more than 600 jobs and represents $140 to $160 million in capital investment over 2026. More here: bit.ly/3SFbJrU