🏆 Recognition is meaningful when it reflects the problem you are solving. Heat is rapidly becoming one of the biggest constraints on next-generation semiconductors. As device performance continues to increase, thermal management is rapidly becoming a critical bottleneck affecting efficiency, reliability, lifetime, and scalability. At CoolSem Technologies, we believe that thermal management must evolve from a supporting function to a core design consideration for next-generation semiconductor and photonic devices. We are proud that the Gerard & Anton Award 2026 recognizes CoolSem Technologies' mission to address this challenge through wafer-level thermal innovation, helping pave the way for cooler, more reliable and more manufacturable semiconductor devices. 👉 Read the full article: https://lnkd.in/e8AyPv3d
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We are proud to be featured by Silicon Semiconductor and Power Electronics Magazine, two leading international publications dedicated to the semiconductor and power electronics industries. Our CEO, Ruud van der Linden, shares the vision behind Cosmic Group and explains how we are building a new global player in semiconductor test solutions. The interview covers: - the value of integrating advanced test equipment with comprehensive test services; - our global expansion across Europe, the US and Asia; - innovations in high-power and mixed-signal test platforms; - the key trends shaping the future of semiconductor testing. Watch the interview: - Silicon Semiconductor https://lnkd.in/e-wihmVq - Power Electronics Magazine https://lnkd.in/emJamjWA A special thanks to Silicon Semiconductor and Power Electronics International Magazine & PE International Conference for the opportunity to share our vision and discuss the future of semiconductor test solutions.
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Excited to share that I attended the seminar on "Semiconductor Technology: Transition to 3nm & 2nm Nodes using Advanced Transistors," organized by SRM-AP at GNITS. The session provided valuable insights into the latest advancements in semiconductor technology and the innovative transistor architectures enabling the transition to 3nm and 2nm technologies. It was fascinating to learn how these developments are driving the next generation of high performance and energy efficient electronic devices.
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What is new in ALD (Q2 2026)? The ALD "supercycle" surged through Q2 2026. While early 2026 focused on sub-2nm logic hardware, Q2 expanded heavily into next-gen memory, automated fabs, and industrial green-tech scaling. Here is the breakdown of the most significant breakthroughs and news in ALD as of mid-2026 (full article with links: https://lnkd.in/eun4QN4R) 1. Low-k Dielectrics Conquer the 1c DRAM Node 2. "Deposition Cobots" Maximize Fab Yields 3. Spatial Roll-to-Roll ALD Goes Mainstream 4. Nano-Armor for Perovskite Solar Cells 5. Consumer Optics Adoption Looking Ahead Following the AVS 26th International Conference in Tampa, the industry's focus for H2 2026 is officially shifting from "how thin can we deposit?" to "how fast and sustainably can we automate?" Expect Q3 to center on Atomic Layer Etching (ALE) and eco-friendly chemistries that shrink mega-fab carbon footprints. #ALDep
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𝗘𝘃𝗲𝗿𝘆 𝗻𝗲𝘄 𝗴𝗲𝗻𝗲𝗿𝗮𝘁𝗶𝗼𝗻 𝗼𝗳 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗲𝗾𝘂𝗶𝗽𝗺𝗲𝗻𝘁 𝗿𝗮𝗶𝘀𝗲𝘀 𝘁𝗵𝗲 𝗯𝗮𝗿 𝗳𝗼𝗿 𝗶𝗻𝘁𝗲𝗿𝗰𝗼𝗻𝗻𝗲𝗰𝘁𝗶𝗼𝗻. Higher data rates, increasing miniaturization and greater system complexity are redefining the requirements for interconnection in semiconductor manufacturing equipment. Interconnection is no longer simply about linking components together. It plays a direct role in signal integrity, reliability and overall system performance. As semiconductor technology continues to advance, so do the engineering challenges behind it. Discover how engineered interconnection solutions support next-generation semiconductor OEMs: https://lnkd.in/eQz_-f3u
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Day 2: The companies that believed in the standard Behind 2,000 Click boards™ are 100+ technology partners - leading semiconductor companies whose chips, sensors, and innovations have helped engineers build faster and smarter for over a decade. Over the years, we've collaborated with hundreds of companies across the industry - these are some of the partners we've worked with most closely, and what they have to say about our journey together. Discover their stories and see what makes our partnerships special. 👇 https://lnkd.in/durtaegD Microchip Technology Inc. Texas Instruments TDK Sequans Communications Allegro MicroSystems Lantronix Vishay Intertechnology, Inc. Swift Navigation EnOcean Ezurio WIZnet BeagleBoard.org Foundation
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🔍 Industry Watch: AMD investing £2bn in UK Developments in testing, measurement, connectivity, and electronics manufacturing often influence future engineering decisions. This update highlights a trend, technology, or industry movement that may be relevant to engineers, laboratories, manufacturers, and technical buyers. What impact do you think this development could have on the industry? 👇 Source available in the FIRST COMMENT.Check out my latest blog article: AMD investing £2bn in UK 👉🏽👉🏽 https://lnkd.in/e5G5KzQv
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Latest Updates from China Market | Today’s Focus: Power Semiconductors, Advanced Displays, Optical Communications, IC Integrated Circuits, Advanced Packaging Follow ULVAC China for real-time insights into China’s semiconductor market. Below are today’s industry highlights (all information sourced from public news)
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Latest Updates from China Market | Today’s Focus: Power Semiconductors, Advanced Displays, Optical Communications, IC Integrated Circuits, Advanced Packaging Follow ULVAC China for real-time insights into China’s semiconductor market. Below are today’s industry highlights (all information sourced from public news)
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Latest Updates from China Market | Today’s Focus: Power Semiconductors, Advanced Displays, Optical Communications, IC Integrated Circuits, Advanced Packaging Follow ULVAC China for real-time insights into China’s semiconductor market. Below are today’s industry highlights (all information sourced from public news)
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Het artikel van IO+ NL eveneens in het Nederlands: https://ioplus.nl/nl/posts/coolsem-integreert-chipkoeling-in-de-waferstack met dank aan Mauro Mereu