The Volt Post’s Post

𝐁𝐢𝐠 𝐦𝐨𝐯𝐞 𝐟𝐨𝐫 𝐔.𝐒. 𝐜𝐡𝐢𝐩𝐬 𝐚𝐧𝐝 𝐀𝐈 𝐡𝐚𝐫𝐝𝐰𝐚𝐫𝐞. 𝐓𝐡𝐞 𝐃𝐞𝐩𝐚𝐫𝐭𝐦𝐞𝐧𝐭 𝐨𝐟 𝐂𝐨𝐦𝐦𝐞𝐫𝐜𝐞 𝐣𝐮𝐬𝐭 𝐬𝐢𝐠𝐧𝐞𝐝 𝐥𝐞𝐭𝐭𝐞𝐫𝐬 𝐨𝐟 𝐢𝐧𝐭𝐞𝐧𝐭 𝐭𝐨 𝐝𝐢𝐫𝐞𝐜𝐭 $874𝐌 𝐢𝐧 𝐂𝐇𝐈𝐏𝐒 𝐚𝐧𝐝 𝐒𝐜𝐢𝐞𝐧𝐜𝐞 𝐀𝐜𝐭 𝐟𝐮𝐧𝐝𝐢𝐧𝐠 𝐭𝐨 𝐬𝐞𝐯𝐞𝐧 𝐜𝐨𝐦𝐩𝐚𝐧𝐢𝐞𝐬 𝐫𝐚𝐜𝐢𝐧𝐠 𝐭𝐨 𝐛𝐮𝐢𝐥𝐝 𝐭𝐡𝐞 𝐧𝐞𝐱𝐭 𝐠𝐞𝐧𝐞𝐫𝐚𝐭𝐢𝐨𝐧 𝐨𝐟 𝐜𝐨𝐦𝐩𝐮𝐭𝐞 𝐢𝐧𝐟𝐫𝐚𝐬𝐭𝐫𝐮𝐜𝐭𝐮𝐫𝐞. 𝐓𝐡𝐢𝐬 𝐢𝐬𝐧’𝐭 𝐚𝐛𝐨𝐮𝐭 𝐟𝐚𝐛𝐬. 𝐈𝐭’𝐬 𝐚𝐛𝐨𝐮𝐭 𝐭𝐡𝐞 𝐡𝐚𝐫𝐝‑𝐭𝐨‑𝐬𝐞𝐞, 𝐡𝐚𝐫𝐝‑𝐭𝐨‑𝐫𝐞𝐩𝐥𝐚𝐜𝐞 𝐥𝐚𝐲𝐞𝐫𝐬 𝐭𝐡𝐚𝐭 𝐦𝐚𝐤𝐞 𝐀𝐈 𝐬𝐲𝐬𝐭𝐞𝐦𝐬 𝐟𝐚𝐬𝐭𝐞𝐫, 𝐦𝐨𝐫𝐞 𝐞𝐟𝐟𝐢𝐜𝐢𝐞𝐧𝐭 𝐚𝐧𝐝 𝐦𝐨𝐫𝐞 𝐬𝐞𝐜𝐮𝐫𝐞: - Co‑packaged optics sitting right next to AI processors - New 3D and ferroelectric memory architectures - Advanced packaging that stacks chips and connects them with thousands of interconnects - Ultra‑low‑loss dielectrics, thermodynamic sampling units, secure supply‑chain tech, and indium‑phosphide‑free photonic substrates 𝐍𝐚𝐦𝐞𝐬 𝐢𝐧 𝐭𝐡𝐞 𝐦𝐢𝐱: GlobalFoundries, Kepler, Multibeam, Extropic, Thintronics®, OBSIDIA Semiconductors and Aeluma. Full details: www.grants.gov (announcement 2025‑NIST‑CHIPS‑CRDO‑01) “With today’s compute supply chain investments, the Trump Administration is accelerating America’s innovation engine,” said Secretary of Commerce Howard W. Lutnick. “These strategic investments will enhance our country’s domestic capabilities, create high-paying jobs and keep America at the forefront of the semiconductor industry.” “These CHIPS R&D incentives will support breakthroughs in compute and communication infrastructures to power next-generation AI capabilities,” said Bill Frauenhofer, the Executive Director for Semiconductor Innovation and Investment at the Department of Commerce. GlobalFoundries Kepler Multibeam Corporation U.S. Department of Commerce National Institute of Standards and Technology (NIST) CHIPS for America #Semiconductors CHIPSAct #AIInfrastructure #AdvancedPackaging #SiliconPhotonics #MemoryTechnology #SupplyChainSecurity #ElectronicsManufacturing #DeepTech #HardwareInnovation #USManufacturing #TechPolicy 𝐃𝐞𝐞𝐩 𝐃𝐢𝐯𝐞 𝐇𝐞𝐫𝐞: https://lnkd.in/ggbJzpXe

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