Original scientific paper
Journal of Microelectronics,
Electronic Components and Materials
Vol. 47, No. 3(2017), 187 – 192
Design of Operational Transconductance
Amplifier with Temperature Compensation
Damjan Berčan, Aleksander Sešek, Janez Trontelj
University of Ljubljana, Faculty of Electrical Engineering, Laboratory for Microelectronics
Abstract: In this paper an operational transconductance amplifier [1] with temperature compensation is presented. It is a voltagecontrolled current source, which operates in an open loop configuration with a single output connected to a resistive load. The
amplifier is internally compensated to keep the gain stable over the -40 °C to 125 °C temperature range. It features low input voltage
noise and operates at supply voltages from 3 V to 5.5 V. Additionally, an internal 1.21 V bandgap reference is used to ensure a stable
internal voltage reference point. The active area of the proposed integrated circuit designed with 0.18 µm Bipolar, CMOS, DMOS
(BCD) technology is 750 µm x 260 µm. It consumes 423 µA of current and it has 8.87 nV/SHz of input noise at 500 kHz. The resulting
simulated voltage gain is 40 dB and variations are less than ±0.3 dB over the temperature range of -40 °C to 125 °C.
Keywords: Operational Transconductance Amplifier; Temperature compensated bias current; Temperature sensitivity optimization
Načrtovanje operacijskega transkonduktančnega
ojačevalnika s temperaturno kompenzacijo
Izvleček: V članku je predstavljen transkonduktančni ojačevalnik s temperaturno kompenzacijo. Na izhod odprto-zančnega
ojačevalnika oziroma napetostno krmiljenega tokovnega vira je priključeno uporovno breme. Notranja kompenzacija skrbi za stabilno
ojačenje v temperaturnem območju od -40 °C do 125 °C. Poleg tega ojačevalnik izkazuje majhen vhodni šum in deluje v napetostnem
območju od 3 V do 5.5 V. Vezje vsebuje napetostno referenco, ki poskrbi za stabilno referenčno točko. Integrirano vezje je bilo načrtano
v 0.18 µm BCD (Bipolar, CMOS, DMOS) tehnologiji, njegova aktivna površina znaša 750 µm x 260 µm. Poraba ojačevalnika znaša 423
µA, njegova šumna gostota na vhodu je 8.87 nV/SHz pri frekvenci 500 kHz. Napetostno ojačenje znaša 40 dB in v temperaturnem
območju od -40 °C do 125 °C odstopa za manj kot ±0.3 dB.
Ključne besede: Transkonduktančni operacijski ojačevalnik; temperaturna kompenzacija delovnega toka; optimizacija temperaturne
občutljivosti
* Corresponding Author’s e-mail:
[email protected]
1 Introduction
One of the major drawbacks of the OTA is its high temperature sensitivity, caused by inversely proportional
temperature variations of gm [2, 3]. Transconductance
of the Metal-Oxide-Semiconductor (MOS) transistor,
using small signal model in saturation region is defined
as follows:
In the paper, an integrated circuit including a symmetrical Operational Transconductance Amplifier (OTA)
with temperature compensation is described. The
OTA can be presented as a voltage controlled current
source. The ideal OTA has very high input and output
impedances and a wide frequency bandwidth. The output current IOUT is proportional to the differential input
voltage and is expressed as:
I OUT = g mVd
g m = 2µ n Cox (
W
)I D
L
(2)
(1)
where µn is carrier mobility, Cox is oxide capacitance, W
is width of the device, L is length of the channel and ID
is drain current [4].
where gm is the transconductance of the amplifier and
Vd is the differential input voltage.
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D. Berčan et al; Informacije Midem, Vol. 47, No. 3(2017), 187 – 192
The root cause of temperature variations is the temperature dependent threshold voltage VT and the carrier
mobility µn variations of the MOS transistor, according
to equations (2) and (3):
VT (T ) = VT (T0 ) + αVT (T − T0 )
T
µ n (T ) = µ n (T0 )
T0
(3)
αµ
(4)
where T0 is the reference temperature (300 °K), αVT and
αµ are negative values which vary with temperature
[5]. As one of possible solutions, a circuit with output
voltage Proportional To Absolute Temperature (PTAT)
can be implemented to compensate the temperature
variations of gm. The difference between the two baseemitter voltages in PTAT is expressed as:
∆VBE = Vt ln( J 2 / J1 )
Figure 1: Block diagram of integrated circuit.
2 Ota circuit design
The block diagram of the OTA with temperature compensation is shown in Fig.1. The main advantage of the
proposed solution is the temperature compensated
bias current. The compensation circuit consists of two
resistors (R1 and R2) having different TC. The block diagram also includes internal a 1.21 V voltage reference
(Vref ), biasing current generator (Ibias generator) which
compensate the temperature variations of gm, two Operational Amplifiers (OPA1 and OPA2) for voltage to
current conversion and OTA circuit. Our objective was
to keep the gain of the OTA stable over the -40 °C to
(5)
where Vt is thermal voltage and J1, J2 are different current densities of bipolar transistors. The PTAT circuit
generates voltage which has a positive Temperature
Coefficient (TC) [4].
The following section (Section 2) presents the OTA design
method to overcome the mentioned problem. In section
3, simulation results for typical simulation conditions, process variations and Monte Carlo analyses are presented.
Figure 2: The schematic of integrated circuit.
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(6)
I bias = − I R1 + I R 2
The bias current Ibias increases with temperature compensating decreasing transconductance of OTA.
3 Simulation results
3.2 Results for typical simulation parameters
The typical process parameters simulations at 25 °C
were performed for the supply voltages 3.3 V and 5 V,
respectively. The simulation results are presented in
Table 1. Input noise density was measured at 500 kHz.
Figure 3: Generated currents.
125 °C temperature range, low input voltage noise and
high Power Supply Rejection Ratio (PSRR).
Table 1: Simulation results at typical simulation conditions.
2.1 Topology of the circuit
Param. \ Suppl.
The schematic of the balanced OTA with temperature
compensation is shown in the Fig. 2. The voltage to
currents converters are used to convert the reference
bandgap voltage to the corresponding current. Both
converters are designed as classic two stage amplifiers with a N type Metal-Oxide-Semiconductor (NMOS)
input differential stage and a common source output
stage including compensation capacitor and resistor.
To ensure precise conversion, the temperature stable
reference voltage is employed. The voltage reference
- bandgap circuit, maintains a stable voltage over the
temperature range and power supply voltage variations. The OTA consists of NMOS input differential stage
and three current mirrors. Transistors M20 – M23 form
the first current mirror stage, M25 – M28 form the second current mirror stage and M13, M14, M18 and M19
form the third current mirror stage. To increase the output impedance the cascode current mirrors are used.
The gate of transistors are connected and biased as
low voltage cascode, which keeps the minimum drain
source voltages of transistor M13, M22 and M25 and
also insures transistor saturation operation. The Length
(L) of transistor M10 is higher in order to compensate
the body effect of cascode transistors M14 and M18 [6].
3.3 V
5V
Units
Ivdda
423
540
µA
G
40.2
40.4
dB
BW
13.6
15.0
MHz
Input noise density
8.87
8.56
nV/√Hz
Input offset voltage
1.08
1.99
mV
CMRR
-132
-142
dB
+SR
9.01
9.60
V/µs
-SR
9.23
9.72
V/µs
PSRR @ 100 Hz
-73.5
-78.2
dB
Transconductance
778
737
µA/V
The input referred noise voltage can be further reduced
by changing the channel W/L ratio of the M15 and M16
transistors or increasing the bias current Ibias. This action would lead to larger chip area (higher cost) and
higher power consumption. To reduce the offset which
effects the performance of the OTA, the auto-zeroing
or chopping technique method could be used, adding
complexity to the design. Precise matching strategies
of the transistors and resistors devices must be used to
minimize offsets and provide symmetry.
2.4 Compensation circuit
Typical performance characteristics for a 3.3 V supply
voltage are shown from Figures 4 to 7. The input referred noise voltage was measured at 500 kHz, while
PSRR was measured at 100 Hz.
The compensation circuit consists of transistors M9
and M10 and two resistors (R1 and R2) with different
TC, which is calculated using the box-method [7], -1618
ppm/ᵒC and 1322 ppm/ᵒC, respectively. The Fig. 3 presents the currents IR1 and IR2, determined by resistors R1
and R2, and bias current Ibias, flowing through M10.
Fig. 4 shows the voltage gain vs. frequency at three
temperatures (-40 °C, 25 °C, 125°C), which is 40 dB. The
results show that the gain sensitivity to temperature
variations are almost eliminated with the presented
design. The bandwidth of the OTA varies from 14.1 MHz
at -40 °C to 12.8 MHz at 125 °C.
The compensation circuit generates bias current Ibias
which is stated as:
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Table 2: Corner analysis results
Parameters
Ivdda
G
BW
Input noise density
Offset
CMRR
+SR
-SR
PSRR @ 100 Hz
Transconductance
FF1
485
41.3
14.5
8.25
1.57
-132
10.28
10.54
-68.9
856
SS1
374
39.2
12.6
9.43
0.71
-130
8.02
8.19
-78.5
715
FS1
430
40.2
13.8
8.81
1.16
-134
9.06
9.3
-75.3
785
SF1
416
40.1
13.3
8.92
1.00
-129
8.95
9.13
-72.1
770
FF2
621
41.5
16.0
7.95
2.72
-140
10.97
11.1
-73.8
816
SS2
476
39.4
14.0
9.13
1.37
-144
8.54
8.65
-83.5
672
FS2
550
40.45
15.2
8.50
2.11
-141
9.66
9.79
-81.3
737
SF2
530
40.32
14.7
8.62
1.89
-143
9.54
9.66
-75.8
737
Units
µA
dB
MHz
nV/SHz
mV
dB
V/µs
V/µs
dB
µA/V
Note1: Supply voltage: 3.3 V
Note2: Supply voltage: 5 V
ential mode gain. At lower frequencies the CMRR varies
from -131 dB at -40 °C to -121 dB at 125 °C. The results
are shown in Fig. 6.
Figure 4: Voltage Gain vs. Frequency
Fig. 5 presents input referred noise voltage density as
a function of frequency at temperatures (-40 °C, 25 °C,
125°C). The noise measured at 500 kHz increases with
temperature from 8.16 nV/√Hz at -40 °C to 10.1 nV/√Hz
at 125 °C.
Figure 6: CMRR vs. Frequency
The PSRR is measured as the ratio of the OTA output
variation vs. the supply voltage variation regardless the
input signal. The PSRR varies from -78.2 dB at -40 °C to
-62.9 dB at 125 °C, measured at 100 Hz. At higher frequencies, PSRR deteriorates. The results are shown in
Fig. 7.
3.2.1 Corner analysis
The process variations of MOSFETs and resistors influence on performance of fabricated integrated circuit.
Therefore, the OTA was simulated for different process
corners – four corner models (FF, SS, FS and SF). The results at 25 °C are gathered in Table 2. The input noise
density was measured at 500 kHz.
Figure 5: Input Noise Voltage vs. Frequency
3.2.2 Monte Carlo simulation
The Common Mode Rejection Ratio (CMRR) is measured as the ratio of the common mode gain to differ-
In this section the results of the Monte Carlo (MC) analysis are shown. The MC simulations were performed
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including mismatch and process variations at typical
conditions (25 °C and 3.3 V) comprising 512 MC runs.
The simulation results are presented in the following
histograms.
and it is slightly higher than the mean value obtained
by MC analysis, which is 40.13 dB with a standard deviation of 0.27 dB.
The offset voltage mean value from MC runs is 1.079
mV with standard deviation of 103.7 uV. It is shown in
Fig. 10.
Figure 7: PSRR vs. Frequency
Fig. 8 shows the resulting histogram of input referred
noise density at 500 kHz, which has a mean value
of 8.873 nV/√Hz and the standard deviation of 151
pV/√Hz. The result is a bit higher than the mean value
of previously shown corner analysis results, which is
8.853 nV/√Hz.
Figure 10: MC test of Offset Voltage
The mean value of the voltage offset from corner analysis is 1.110 mV, which is higher than the MC results.
The comparison between corner and MC analyses must
be done carefully as the corner analysis comprises also
temperature and supply voltage variations, which especially influence voltage offset.
4 Layout of presented circuit
The layout of the presented integrated circuit is shown
on Fig. 11.
Figure 8: MC test of Input Voltage Noise
The voltage gain distribution is shown in the Fig. 9. The
mean value from the corner analysis results is 40.20 dB
Figure 11: Layout of the integrated circuit
Figure 9: MC test of Voltage Gain
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The active area of the circuit, without bonding pads
and supply connection rings, is 750 µm x 260 µm. The
integrated circuit has been designed with the 0.18 µm
BCD technology as a part of the System on Chip (SoC).
The BCD technology allows mixed - signal design using
low and high voltage transistors (DMOS) on the same
die (reduces cost, area and power consumption). The
voltage to current converter main part is presented by
resistors R1 – N+ poly without salicide and R2 – N+ diffusion without salicide, which means that resistors do
not have an additional process mask of salicide, reducing the sheet resistance (Ω/sq) of the resistors. For ASIC
area reduction, N – well resistors could be used, but
they have high nonlinearity and larger parasitic capacitance between N – well and substrate. The integrated
circuit has been sent to the fabrication factory.
4.
5.
6.
7.
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I. M. Filanovsky in A. Allam, „Mutual compensation
of mobility and threshold voltage temperature
effects with applications in CMOS circuits“, IEEE
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št. 7, str. 876–884, jul. 2001.
T. C. Carusone, K. W. Martin, in D. Johns, Analog integrated circuit design, 2nd edition. Hoboken, N.J.:
John Wiley & Sons, 2011.
M. E. T. Instruments, „Voltage Reference Selection
Basics“. Available at: http://www.ti.com/lit/wp/
slpy003/slpy003.pdf. Accessed: [6.8.2016]
Arrived: 31. 08. 2017
Accepted: 11. 12. 2017
5 Conclusions and next steps
The OTA was designed and analyzed using the 0.18
µm BCD technology. The temperature sensitivity of the
OTA has been optimized and reduced, using the bias
control technique and a stable internal voltage reference. The proposed circuit shows voltage gain variations lower than ±0.3 dB in the temperature range from
-40 °C to 125 °C and lower than 0.5 dB when varying
the supply voltage in the range from 3 V to 5.5 V. The
equivalent input referred noise voltage is simulated to
be lower than 10 nV/√Hz at 500 kHz and 25 °C, and voltage offset lower than 2.8 mV. To overcome the problem
of process variations, especially the resistors R1 and R2
which are used for compensation current generation
and are one of the most critical elements in compensations circuit, the resistance of both R1 and R2 resistors will be precisely trimmed. The issue could be easily solved by employing effective and uncomplicated
trimming resistor stage for each of them separately and
internal One-Time-Programmable (OTP) memory cells.
6 References
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