GlobalFoundries receives $300M US funding to advance silicon photonics, targeting 400Gb/s speeds and 5x energy efficiency for AI data centers. https://lnkd.in/dHNNJ7q6
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GlobalFoundries receives $300M US funding to advance silicon photonics, targeting 400Gb/s speeds and 5x energy efficiency for AI data centers. https://lnkd.in/dZyuKbN3
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At EETimes, Sicoya together with our colleagues at STMicroelectronics share a few thoughts about the challenges and directions for volume scaling of silicon photonics: https://lnkd.in/dmYbYGnm
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Looking forward to discussing how we can strengthen the UK's semiconductor ecosystem and ensure innovation translates into scalable commercial success 🚀
🎤 Another outstanding speaker joins the TechWorks S2S26 Summit! 🎤 We're delighted to welcome Elizabeth Patterson, Senior Programme and Policy Manager, Seagate Technology, who is joining the exceptional speaker line-up in the Scale track, hosted by UK Semiconductor Centre at the TechWorks Semiconductors to Systems Summit (S2S26) on 26 August 2026 at Novotel London West, London. Elizabeth has a strategic focus on photonics innovation and commercialisation. Lizzie plays a pivotal role in shaping Seagate Technology’s engagement with UK and EU photonics ecosystems, driving initiatives that bridge research and industry across quantum, AI, and semiconductor application. Join us in London on 26 August for what is shaping up to be a fantastic day. To find out more and to register for the event click on the link below 👇 https://lnkd.in/evf8YEka
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US to award $300 million to GlobalFoundries to boost silicon photonics R&D for AI data centers #GlobalFoundries #siliconphotonics #semiconductors #technologynews Read More: https://lnkd.in/gr2gK_Zu
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Countries are racing to build factories for these light‑based chips because whoever controls them controls big chunks of future AI and quantum tech. If you’ve ever wondered where “AI infrastructure” really lives, this is the story. read the full breakdown on silicon photonics here - https://lnkd.in/e7zhFAdJ
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𝐒𝐢𝐥𝐢𝐜𝐨𝐧 𝐩𝐡𝐨𝐭𝐨𝐧𝐢𝐜𝐬 𝐢𝐬 𝐦𝐨𝐯𝐢𝐧𝐠 𝐟𝐫𝐨𝐦 𝐩𝐫𝐨𝐦𝐢𝐬𝐞 𝐭𝐨 𝐩𝐫𝐨𝐝𝐮𝐜𝐭𝐢𝐨𝐧 𝐚𝐧𝐝 𝐭𝐡𝐢𝐬 𝐢𝐬 𝐚 𝐛𝐢𝐠 𝐦𝐨𝐦𝐞𝐧𝐭. SILITH Technology and UMC have announced the first mass-production delivery of photonic IC wafers from UMC’s Singapore fab, marking a key step toward scaling AI-ready optical interconnects. 𝐖𝐡𝐚𝐭 𝐦𝐚𝐤𝐞𝐬 𝐭𝐡𝐢𝐬 𝐧𝐨𝐭𝐚𝐛𝐥𝐞: - A 1.6T silicon photonics platform, now production-ready in just 18 months High yield and reliability, already qualified by a leading cloud infrastructure player - A clear roadmap from 200G/lane to 400G/lane, pushing bandwidth boundaries - As AI workloads scale, traditional electrical interconnects are hitting limits in power and performance. Silicon photonics is emerging as the critical enabler for faster, more efficient data movement inside hyperscale data centers. 𝐏𝐥𝐚𝐧𝐬 𝐭𝐨 𝐨𝐩𝐞𝐧 𝐢𝐭𝐬 12-𝐢𝐧𝐜𝐡 𝐩𝐡𝐨𝐭𝐨𝐧𝐢𝐜𝐬 𝐩𝐥𝐚𝐭𝐟𝐨𝐫𝐦 𝐭𝐨 𝐜𝐮𝐬𝐭𝐨𝐦𝐞𝐫𝐬 𝐢𝐧 2027 𝐚𝐧𝐝 𝐩𝐚𝐫𝐚𝐥𝐥𝐞𝐥 𝐰𝐨𝐫𝐤 𝐨𝐧 𝐓𝐅𝐋𝐍 𝐟𝐨𝐫 𝐟𝐮𝐭𝐮𝐫𝐞 𝐮𝐥𝐭𝐫𝐚-𝐡𝐢𝐠𝐡 𝐛𝐚𝐧𝐝𝐰𝐢𝐝𝐭𝐡, 𝐔𝐌𝐂 𝐢𝐬 𝐩𝐨𝐬𝐢𝐭𝐢𝐨𝐧𝐢𝐧𝐠 𝐢𝐭𝐬𝐞𝐥𝐟 𝐚𝐭 𝐭𝐡𝐞 𝐜𝐞𝐧𝐭𝐞𝐫 𝐨𝐟 𝐧𝐞𝐱𝐭-𝐠𝐞𝐧 𝐨𝐩𝐭𝐢𝐜𝐚𝐥 𝐢𝐧𝐟𝐫𝐚𝐬𝐭𝐫𝐮𝐜𝐭𝐮𝐫𝐞. United Microelectronics Corporation (UMC) SiLith #SiliconPhotonics #AIInfrastructure #OpticalInterconnects #DataCenters #Semiconductors #Photonics #UMC #HighPerformanceComputing #CPO #OpticalIO #NextGenAI #AdvancedPackaging #TFLN 𝐃𝐞𝐞𝐩 𝐃𝐢𝐯𝐞 𝐇𝐞𝐫𝐞: https://lnkd.in/gYAByuWh
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Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon https://lnkd.in/eBT5iurd “As semiconductor complexity continues to grow, including in AI ASICs, engineering teams increasingly need ways to reuse proven infrastructure and focus their efforts on high-performance differentiation,” said K. Charles Janac, president and CEO of Arteris. “The collaboration between IC-Link by imec and Arteris reflects a broader industry shift toward reusable architectures that help improve productivity, reduce risk, and accelerate innovation across AI and HPC semiconductor development.” Read more at https://lnkd.in/eBT5iurd #NoC #NetworkOnChip #semiIP #IPcores #semiconductor
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How do we keep AI on a sustainable and scalable growth path? As AI workloads continue to grow, the industry faces a difficult challenge: translating technology advances into systems that can deliver meaningful gains in performance, power efficiency, and manufacturability at scale. At ITF Taiwan, experts from across the semiconductor ecosystem will discuss some of the key technologies driving that transition, including High-NA EUV, CMOS 2.0, heterogeneous integration, integrated photonics for AI infrastructure, advanced memory technologies, and 3D integration. The program features perspectives from K.C. Hsu (TSMC), Teng Chow Ooi (FusionAP), James Palles-Dimmock (Quantum Motion), and Patrick Vandenameele (imec), alongside leaders from across the broader semiconductor value chain. Read more: https://lnkd.in/eyzXgFzv
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UMC & SILITH Mass-Produce 12-inch Silicon Photonics Wafers A major milestone for AI data center optical interconnects! On July 14th, UMC teamed up with Singapore-based silicon photonics designer SILITH to officially ship mass-produced 12-inch silicon photonics wafers from UMC’s Singapore fab. This breakthrough marks a critical shift for silicon photonics technology: moving from R&D validation to high-volume commercial production, laying a solid foundation for next-gen 1.6T optical solutions for AI and hyperscale data centers. The high-yield production platform has already passed qualification by a leading global cloud customer for large-scale deployment. As UMC’s key 12-inch silicon photonics partner, SILITH supplies top optical transceiver players including Innolight and Coherent — core suppliers for NVIDIA and Google’s data center infrastructure. Looking ahead, both sides will further upgrade the roadmap, advancing from current 200G/lane products to next-generation 400G/lane optical interconnect solutions. UMC is also accelerating its long-term layout: ✅ 2027: Launch self-developed 12-inch silicon photonics platform + advanced packaging services ✅ 2028: Release open silicon photonics platform to empower broader optical chip innovation ✅ Collaborate on TFLN solutions for future ultra-high-bandwidth interconnection Driven by booming AI infrastructure demand, the global CPO/NPO market is projected to exceed $39 billion by 2030, with rapid growth starting in 2028. Silicon photonics is becoming the core engine for breaking bandwidth bottlenecks in high-performance computing. The industrial mass-production era has officially arrived. Learn more about Ezkey Electronics: 🌐 www.e-z-key.com #Semiconductor #SiliconPhotonics #UMC #SILITH #AI #DataCenter #OpticalInterconnect #CPO #TechInnovation #HardwareSupplyChain
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SiLith and United Microelectronics Corporation (UMC) achieve a major silicon photonics mass production milestone for AI infrastructure. 𝗝𝗮𝘀𝗼𝗻 𝗭𝗵𝗮𝗻𝗴, Chief Technology Officer, SILITH, says the collaboration will accelerate scalable silicon photonics for next-generation AI networks. 𝗚𝗖 𝗛𝘂𝗻𝗴, Senior Vice President, UMC, highlights the company's high-volume manufacturing capabilities in advancing AI optical interconnects. How will this milestone shape the future of AI data center connectivity? Read the full story on IT Tech News: https://lnkd.in/dY34jwFZ #SILITH #UMC #SiliconPhotonics #Semiconductor #AIInfrastructure #DataCenters #ITTechNews #TechNews #TechnologyNews
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