𝐒𝐢𝐥𝐢𝐜𝐨𝐧 𝐩𝐡𝐨𝐭𝐨𝐧𝐢𝐜𝐬 𝐢𝐬 𝐦𝐨𝐯𝐢𝐧𝐠 𝐟𝐫𝐨𝐦 𝐩𝐫𝐨𝐦𝐢𝐬𝐞 𝐭𝐨 𝐩𝐫𝐨𝐝𝐮𝐜𝐭𝐢𝐨𝐧 𝐚𝐧𝐝 𝐭𝐡𝐢𝐬 𝐢𝐬 𝐚 𝐛𝐢𝐠 𝐦𝐨𝐦𝐞𝐧𝐭. SILITH Technology and UMC have announced the first mass-production delivery of photonic IC wafers from UMC’s Singapore fab, marking a key step toward scaling AI-ready optical interconnects. 𝐖𝐡𝐚𝐭 𝐦𝐚𝐤𝐞𝐬 𝐭𝐡𝐢𝐬 𝐧𝐨𝐭𝐚𝐛𝐥𝐞: - A 1.6T silicon photonics platform, now production-ready in just 18 months High yield and reliability, already qualified by a leading cloud infrastructure player - A clear roadmap from 200G/lane to 400G/lane, pushing bandwidth boundaries - As AI workloads scale, traditional electrical interconnects are hitting limits in power and performance. Silicon photonics is emerging as the critical enabler for faster, more efficient data movement inside hyperscale data centers. 𝐏𝐥𝐚𝐧𝐬 𝐭𝐨 𝐨𝐩𝐞𝐧 𝐢𝐭𝐬 12-𝐢𝐧𝐜𝐡 𝐩𝐡𝐨𝐭𝐨𝐧𝐢𝐜𝐬 𝐩𝐥𝐚𝐭𝐟𝐨𝐫𝐦 𝐭𝐨 𝐜𝐮𝐬𝐭𝐨𝐦𝐞𝐫𝐬 𝐢𝐧 2027 𝐚𝐧𝐝 𝐩𝐚𝐫𝐚𝐥𝐥𝐞𝐥 𝐰𝐨𝐫𝐤 𝐨𝐧 𝐓𝐅𝐋𝐍 𝐟𝐨𝐫 𝐟𝐮𝐭𝐮𝐫𝐞 𝐮𝐥𝐭𝐫𝐚-𝐡𝐢𝐠𝐡 𝐛𝐚𝐧𝐝𝐰𝐢𝐝𝐭𝐡, 𝐔𝐌𝐂 𝐢𝐬 𝐩𝐨𝐬𝐢𝐭𝐢𝐨𝐧𝐢𝐧𝐠 𝐢𝐭𝐬𝐞𝐥𝐟 𝐚𝐭 𝐭𝐡𝐞 𝐜𝐞𝐧𝐭𝐞𝐫 𝐨𝐟 𝐧𝐞𝐱𝐭-𝐠𝐞𝐧 𝐨𝐩𝐭𝐢𝐜𝐚𝐥 𝐢𝐧𝐟𝐫𝐚𝐬𝐭𝐫𝐮𝐜𝐭𝐮𝐫𝐞. United Microelectronics Corporation (UMC) SiLith #SiliconPhotonics #AIInfrastructure #OpticalInterconnects #DataCenters #Semiconductors #Photonics #UMC #HighPerformanceComputing #CPO #OpticalIO #NextGenAI #AdvancedPackaging #TFLN 𝐃𝐞𝐞𝐩 𝐃𝐢𝐯𝐞 𝐇𝐞𝐫𝐞: https://lnkd.in/gYAByuWh
UMC Delivers First Mass-Production Silicon Photonics Wafers
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A major shift from electronics to photonics is underway, with Pilot Photonics securing €10.4 million from the European Innovation Council to advance its patented photonic chip technology. This innovative approach utilizes laser light to generate pure wireless signals, enhancing power efficiency and bandwidth capabilities for sectors like AI data centers and 5G networks. By making photonic components compact and cost-effective, Pilot Photonics is lowering barriers in critical industries, proving essential for the evolving landscape where bandwidth demands soar. As demand for photonic chip technologies grows, this funding will fuel the company's expansion in manufacturing and workforce. Discover how Pilot Photonics is reshaping the future of technology. https://lnkd.in/dqBYbkvD #photonicchips #technologyinnovation #6G
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Advantest, OpenLight Join Forces to Develop Silicon Photonics Test Solutions for High-Volume Manufacturing Advantest and OpenLight have announced a strategic collaboration to develop scalable silicon photonics test solutions for high-volume manufacturing. By combining Advantest's expertise in semiconductor test systems with OpenLight's leadership in heterogeneous silicon photonics integration, the partnership aims to address the growing demand for efficient testing of next-generation photonic devices. The collaboration is expected to accelerate the adoption of silicon photonics and optical interconnect technologies for AI infrastructure, high-performance computing, data centers, and high-speed networking by enabling robust end-to-end test solutions for scalable production. Read more - https://lnkd.in/ediH9vNk #SiliconPhotonics #Semiconductor #OpticalInterconnect #DataCenters #Technology
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One of the biggest shifts we've noticed over the past 12 months is just how quickly conversations around AI infrastructure and optical interconnects have accelerated. As AI clusters continue to scale, bandwidth, power efficiency and latency are becoming just as important as compute itself. That's driving innovation across: • Silicon photonics • Optical transceivers • Optical engines • Co-packaged optics (CPO) • High-speed laser technologies The next generation of AI infrastructure will be built through collaboration between semiconductor manufacturers, photonics innovators, equipment suppliers, foundries, software providers and the organisations deploying these technologies at scale. Microelectronics UK will be bringing together organisations from right across that ecosystem this September. Companies already involved include Hamamatsu Corporation, KLA, Oxford Instruments GmbH, CORNERSTONE, Eblana Photonics Ltd, Photon Force, Siemens EDA (Siemens Digital Industries Software), Synopsys Inc, Photodigm, Helia Photonics Ltd, Photronics and Cadence. They will be joined by visitors from the likes of Cisco, IQE, Amazon Web Services (AWS), Meta, Nokia, Ciena, Marvell Technology and Infineon Technologies, alongside speakers from BAE Systems, Airbus Defence and Space, BT Group, Intel, Arm, the University of Southampton and many of the UK's leading research institutions. These are exactly the kinds of conversations that will shape the future of AI networking, optical communications and next-generation data centre infrastructure. Really looking forward to seeing those conversations unfold in London this September. #Photonics #Semiconductors #SiliconPhotonics #AIInfrastructure #OpticalNetworking #DataCentres #Microelectronics #MicroelectronicsUK
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Jason Zhang, Chief Technology Officer of SiLith, said: “AI is driving an unprecedented demand for optical bandwidth, making silicon photonics a foundational technology for future data centre infrastructure. At SILITH, we are building a scalable silicon photonics platform that spans pluggable optics, co-packaged optics (CPO), and future optical I/O architectures. Together with UMC, we are bringing together leading-edge silicon photonics innovation and high-volume 12-inch manufacturing to deliver the performance, scalability, and cost efficiency required for the next generation of AI networks.” #SILITH #UMC #SiliconPhotonics #PhotonicChips #Semiconductor #AIInfrastructure #OpticalNetworking #DataCenters #ChipInnovation #SemiconLeadersAsia https://lnkd.in/d3i8RMnq
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United Microelectronics Corporation (UMC) has begun mass-producing advanced silicon photonics chips at its Singapore facility to strengthen global AI connectivity.
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UMC & SILITH Mass-Produce 12-inch Silicon Photonics Wafers A major milestone for AI data center optical interconnects! On July 14th, UMC teamed up with Singapore-based silicon photonics designer SILITH to officially ship mass-produced 12-inch silicon photonics wafers from UMC’s Singapore fab. This breakthrough marks a critical shift for silicon photonics technology: moving from R&D validation to high-volume commercial production, laying a solid foundation for next-gen 1.6T optical solutions for AI and hyperscale data centers. The high-yield production platform has already passed qualification by a leading global cloud customer for large-scale deployment. As UMC’s key 12-inch silicon photonics partner, SILITH supplies top optical transceiver players including Innolight and Coherent — core suppliers for NVIDIA and Google’s data center infrastructure. Looking ahead, both sides will further upgrade the roadmap, advancing from current 200G/lane products to next-generation 400G/lane optical interconnect solutions. UMC is also accelerating its long-term layout: ✅ 2027: Launch self-developed 12-inch silicon photonics platform + advanced packaging services ✅ 2028: Release open silicon photonics platform to empower broader optical chip innovation ✅ Collaborate on TFLN solutions for future ultra-high-bandwidth interconnection Driven by booming AI infrastructure demand, the global CPO/NPO market is projected to exceed $39 billion by 2030, with rapid growth starting in 2028. Silicon photonics is becoming the core engine for breaking bandwidth bottlenecks in high-performance computing. The industrial mass-production era has officially arrived. Learn more about Ezkey Electronics: 🌐 www.e-z-key.com #Semiconductor #SiliconPhotonics #UMC #SILITH #AI #DataCenter #OpticalInterconnect #CPO #TechInnovation #HardwareSupplyChain
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GlobalFoundries receives $300M US funding to advance silicon photonics, targeting 400Gb/s speeds and 5x energy efficiency for AI data centers. https://lnkd.in/dHNNJ7q6
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SiLith and United Microelectronics Corporation (UMC) have achieved mass production of silicon photonics wafers for next-generation AI networking applications. Jason Zhang — Chief Technology Officer of SILITH G.C. Hung — Senior Vice President of UMC #SILITHTechnology #UMC #SiliconPhotonics #PIC #AIOpticalInterconnects #1_6T #CoPackagedOptics #OpticalIO #12inchWafer #Singapore #TFLN #MachZehnderModulator #AIDataCenters #OpticalNetworking https://lnkd.in/gU_7VwN3
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SiLith and United Microelectronics Corporation (UMC) Achieve Mass Production Milestone for #Silicon #Photonics https://lnkd.in/e_sFgT_3 ✔️ UMC delivers first mass-produced silicon photonics wafers from UMC’s Singapore 12-inch fab, marking a step change from development to high-volume manufacturing. ✔️ The collaboration combines SILITH's silicon photonics innovation with UMC's high-volume 12-inch manufacturing platform. ✔️ UMC’s silicon photonics process integration is a scalable, foundry-ready manufacturing platform—aimed at delivering predictable cost, yield, and ramp timelines for customers building next-generation AI data center optical interconnects Read more at https://lnkd.in/e_sFgT_3 #chiplet #3DIC #AdvancedPackaging #MultiDie #semiconductor
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